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INTEGRATED CIRCUITS
DATA SHEET
TJA1054 Fault-tolerant CAN transceiver
Preliminary specification File under Integrated Circuits, IC18 1999 Feb 11
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
FEATURES Optimized for in-car low-speed communication * Baud rate up to 125 kBaud * Up to 32 nodes can be connected * Supports unshielded bus wires * Very low Radio Frequency Interference (RFI) due to built-in slope control function and a very good matching of the CANL and CANH bus outputs * Fully integrated receiver filters * Permanent dominant monitoring of transmit data input * Good immunity performance of ElectroMagnetic Compatibility (EMC) in normal operating mode and in low power modes. Bus failure management * Supports single-wire transmission modes with ground offset voltages up to 1.5 V * Automatic switching to single-wire mode in the event of bus failures, even when the CANH bus wire is short-circuited to VCC * Automatic reset to differential mode if bus failure is removed * Fully wake-up capability during failure modes. Protection * Short-circuit proof to battery and ground in 12 V powered systems * Thermally protected * Bus lines protected against transients in an automotive environment * An unpowered node does not disturb the bus lines. Support for low power modes * Low current sleep and standby mode with wake-up via the bus lines * Power-on reset flag on the output. ORDERING INFORMATION TYPE NUMBER TJA1054T PACKAGE NAME SO14 DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm GENERAL DESCRIPTION
TJA1054
The TJA1054 is the interface between the protocol controller and the physical wires of the bus lines in a Control Area Network (CAN). It is primarily intended for low-speed applications, up to 125 kBaud, in passenger cars. The device provides differential transmit capability but will switch in error conditions to single-wire transmitter and/or receiver. The TJA1054T is pin and upwards compatible with the PCA82C252T and the TJA1053T. This means that these two devices can be replaced by the TJA1054T with retention of all functions. The most important improvements are: * Very low RFI due to a very good matching of the CANL and CANH bus lines outputs * Good immunity performance of EMC, especially in low power modes * Fully wake-up capability during failure modes * Extended bus failure management including short-circuit of the CANH bus line to VCC * Supports easy fault localization * Two-edge sensitive wake-up input signal via pin WAKE.
VERSION SOT108-1
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
QUICK REFERENCE DATA SYMBOL VCC VBAT PARAMETER supply voltage on pin VCC battery voltage on pin BAT no time limit operating mode load dump IBAT VCANH battery current on pin BAT CANH bus line voltage CONDITIONS MIN. 4.75 -0.3 5.0 - - - - - 30 - TYP.
TJA1054
MAX. 5.25 +40 27 40 50 +40 V V V V
UNIT
Sleep mode; VCC = 0 V; - VBAT = 12 V VCC = 0 to 5.5 V; VBAT 0 V; no time limit VCC = 0 to 5.5 V; VBAT 0 V; no time limit -40
A V
VCANL
CANL bus line voltage
-40
-
+40
V
VCANH VCANL tPD tr tf Tamb
CANH bus line transmitter voltage drop ICANH = -40 mA CANH bus line transmitter voltage drop ICANL = 40 mA propagation delay bus line output rise time bus line output fall time operating ambient temperature TXD to RXD 10 to 90%; C1 = 10 nF 90 to 10%; C1 = 1 nF
- - - - - -40
- - 1 0.6 0.3 -
1.4 1.4 - - - +125
V V s s s C
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
BLOCK DIAGRAM
TJA1054
handbook, full pagewidth
BAT 14
VCC 10
INH WAKE STB EN
1 7 5 6 VCC 2 DRIVER TIMER WAKE-UP STANDBY CONTROL TEMPERATURE PROTECTION 9 11 12 8 RTL CANH CANL RTH
TXD
VCC 4 FAILURE DETECTOR PLUS WAKE-UP PLUS TIME-OUT
TJA1054
ERR
VCC 3 RECEIVER
FILTER
RXD
FILTER
13 GND
MGL421
Fig.1 Block diagram.
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
PINNING SYMBOL INH TXD RXD ERR STB EN WAKE RTH RTL VCC CANH CANL GND BAT PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DESCRIPTION
TJA1054
inhibit output for switching an external voltage regulator if a wake-up signal occurs transmit data input for activating the driver to the bus lines receive data output for reading out the data from the bus lines error, wake-up and power-on indication output; active LOW in normal operating mode when the bus has a failure and in low power modes (wake-up signal or in power-on standby) standby digital control signal input (active LOW); defines together with input signal on pin EN the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3 enable digital control signal input; defines together with input signal on pin STB the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3 local wake-up signal input; falling and rising edges are both detected termination resistor connection; in case of a CANH bus wire error the line is terminated with a selectable impedance termination resistor connection; in case of a CANL bus wire the line is terminated with a selectable impedance supply voltage HIGH-level voltage bus line LOW-level voltage bus line ground battery supply
handbook, halfpage
INH TXD RXD ERR STB EN WAKE
1 2 3 4 5 6 7
MGL422
14 BAT 13 GND 12 CANL
TJA1054T 11 CANH
10 VCC 9 8 RTL RTH
Fig.2 Pin configuration.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
FUNCTIONAL DESCRIPTION The TJA1054 is the interface between the CAN protocol controller and the physical wires of the CAN bus (see Fig.7). It is primarily intended for low speed applications, up to 125 kBaud, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. To reduce RFI, the rise and fall slope are limited. This allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. Moreover, it supports transmission capability on either bus line if one of the wires is corrupted. The failure detection logic automatically selects a suitable transmission mode. In normal operating mode (no wiring failures) the differential receiver is output on pin RXD (see Fig.1). The differential receiver inputs are connected to pins CANH and CANL through integrated filters. The filtered input signals are also used for the single-wire receivers. The receivers connected to pins CANH and CANL have threshold voltages that ensure a maximum noise margin in single-wire mode. A timer has been integrated at pin TXD. This timer prevents the TJA1054 from driving the bus lines to a permanent dominant state. Failure detector The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to the appropriate mode (see Table 1). Table 1 Bus failures DESCRIPTION CANH wire interrupted CANL wire interrupted CANH short-circuited to battery CANH short-circuited to VCC CANL short-circuited to ground CANH short-circuited to ground CANL short-circuited to battery CANL short-circuited to VCC CANL mutually short-circuited to CANH
TJA1054
The differential receiver threshold voltage is set at -3.2 V typically (VCC = 5 V). This ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 4 and 6a. These failures, or recovery from them, do not destroy ongoing transmissions. Failures 3 and 6 are detected by comparators connected to the CANH and CANL bus lines, respectively. If the comparator threshold is exceeded for a certain period of time, the reception is switched to the single-wire mode. This time is needed to avoid false triggering by external RF fields. Recovery from these failures is detected automatically after a certain time-out (filtering) and no transmission is lost. In the event of failure 3 the CANH driver and pin RTH are switched off. In the event of failure 6 the CANL driver and pin RTL are switched off. The pull-up current on pin RTL and the pull-down current on pin RTH will not be switched off. Failures 3a, 4 and 7 initially result in a permanent dominant level on pin RXD. After a time-out, the CANL driver and pin RTL are switched off (failures 4 and 7) or the CANH driver and pin RTH are switched off (failure 3a). Only a weak pull-up on pin RTL or a weak pull-down on pin RTH remains. Reception continues by switching to the single-wire mode via pins CANH or CANL. When failures 3a, 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. If any of the wiring failure occurs, the output signal on pin ERR will become LOW. On error recovery, the output signal on pin ERR will become HIGH again. During all single-wire transmissions, the EMC performance (both immunity and emission) is worse than in the differential mode. The integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HF suppression. In the single-wire mode, LF noise cannot be distinguished from the required signal.
FAILURE 1 2 3 3a 4 5 6 6a 7
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
Low power modes The transceiver provides 3 low power modes which can be entered and exited via pins STB and EN (see Table 2 and Fig.3). The Sleep mode is the mode with the lowest power consumption. Pin INH is switched to high-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL. If the supply voltage is provided pins RXD and ERR will signal the wake-up interrupt signal. The standby mode will react the same as the Sleep mode but with a HIGH-level on pin INH. The power-on standby mode is the same as the standby mode with the battery power-on flag instead of the wake-up interrupt signal on pin ERR. The output on pin RXD will show the wake-up interrupt. This mode is only for reading out the power-on flag. Wake-up requests are recognized by the transceiver when a dominant signal is detected on either bus line or if pin WAKE detects an edge (rising or falling) which stays longer HIGH or LOW respectively during a certain period of time. On a wake-up request the transceiver will set the output on pin INH which can be used to activate the external supply voltage regulator. Table 2 Normal operating and low power modes ERR MODE Goto-sleep command Sleep Standby Power-on standby Normal operating Notes STB 0 0 0 1 EN LOW 1 0(1) 0 0 VBAT power-on flag; notes 2 and 4 error flag no error flag wake-up interrupt signal; notes 2 and 3 dominant received data wake-up interrupt signal; notes 2 and 3 wake-up interrupt signal; notes 2 and 3 HIGH LOW HIGH RXD
TJA1054
If VCC is provided the wake-up request can be read on the ERR or RXD outputs, so the external microcontroller can wake-up the transceiver (switch to normal operating mode) via pins STB and EN. To prevent false wake-up due to transients or RF fields, the wake-up voltage levels have to be maintained for a certain period of time. In the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures 3, 3a, 4 and 7. Pin INH is set to floating only during the goto-sleep command and stays floating during the Sleep mode. If pin INH is set to floating, pin INH will not be set to HIGH-level again just by a mode change to normal operating mode. Pin INH will be set to HIGH-level by the following events only: * power-on (VBAT switching-on at cold start) * rising or falling edge on pin WAKE * a message with 5 consecutive dominant bits during pin EN or pin STB is at LOW-level. The signals on pins STB and EN will internally be set to LOW-level when VCC is below a certain threshold voltage so providing fail safe functionality.
RTL SWITCHED TO VBAT VBAT VBAT VBAT
1
1
recessive received data
VCC
1. In case the goto-sleep command was used before. When VCC drops pin EN will become LOW, but this does not effect the internal functions due to the fail safe functionality. 2. If the supply voltage VCC is present. 3. Wake-up interrupts are released when entering the normal operating mode. 4. VBAT power-on flag will be reset when entering the normal operating mode.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
Power-on
TJA1054
After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal power-on flag will be set. This flag can be read in the power-on standby mode via pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode. Protections A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. If the junction temperature exceeds a maximum value, the transmitter output stages are disabled. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the IC will remain operating. The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment.
handbook, full pagewidth
POWER-ON STANDBY 10
NORMAL (4) 11
GOTO (5) SLEEP 01
(1) (2) (3)
STANDBY 00
MBK949
SLEEP 00
(1) Mode change via input ports STB and EN. (2) Mode change via input ports STB and EN, but in the sleep mode INH is inactive and possibly there is no VCC. Mode control is only possible if VCC of the transceiver is active. (3) INH is activated after wake-up via bus or input port WAKE. (4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared. (5) Transitions to sleep mode: INH is deactivated.
Fig.3 Mode control.
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); note 1. SYMBOL VCC VBAT Vn VCANH VCANL Vtrt(n) VWAKE IWAKE VINH VRTH VRTL RRTH RRTL Tvj Tstg Vesd PARAMETER supply voltage on pin VCC battery voltage on pin BAT DC voltage on pins 2 to 6 DC voltage on pin CANH DC voltage on pin CANL transient voltage on pins CANH and CANL DC input voltage on pin WAKE DC input current on pin WAKE DC output voltage on pin INH DC voltage on pin RTH DC voltage on pin RTL termination resistance on pin RTH termination resistance on pin RTL virtual junction temperature storage temperature electrostatic discharge voltage human body model; note 3 machine model; note 4 Notes 1. All voltages are defined with respect to pin GND. Positive current flows into the IC. note 2 see Fig.6 CONDITIONS MIN. -0.3 -0.3 -0.3 -40 -40 -150 - -15 -0.3 -0.3 -0.3 500 500 -40 -55 -2.0 -200 +6 +40
TJA1054
MAX.
UNIT V V V V V V V mA V V V C C kV V
VCC + 0.3 +40 +40 +100 VBAT + 0.3 - VBAT + 0.3 VBAT + 1.2 VBAT + 1.2 16000 16000 +150 +150 +2.0 +200
2. Junction temperature in accordance with "IEC 747-1". An alternative definition is: Tvj = Tamb + P x Rth(vj-a) where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and operating ambient temperature (Tamb). 3. Equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 4. Equivalent to discharging a 200 pF capacitor through a 10 resistor and a 0.75 H coil. THERMAL CHARACTERISTICS SYMBOL Rth(vj-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 120 UNIT K/W
QUALITY SPECIFICATION Quality specification in accordance with "SNW-FQ-611-Part-E".
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
DC CHARACTERISTICS VCC = 4.75 to 5.25 V; VBAT = 5 to 27 V; VSTB = VCC; Tamb = -40 to +125 C; unless otherwise specified. All voltages are defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature range by design, but only 100% tested at 25 C. SYMBOL Supplies ICC supply current normal operating mode; VTXD = VCC (recessive) normal operating mode; VTXD = 0 V (dominant); no load low power modes; VTXD = VCC IBAT battery current on pin BAT all modes; in low power modes at VRTL = VBAT or VRTL < 2.5 V (>1.5 ms) VBAT = VWAKE = VINH = 12 V VBAT = VWAKE = VINH = 5 to 27 V VBAT =VWAKE = VINH = 3.5 V VBAT = VWAKE = VINH = 1 V ICC + IBAT supply current plus battery low power modes; VCC = 5 V; current VBAT = VWAKE = VINH = 12 V VBAT battery voltage on pin BAT low power modes for setting power-on flag for not setting power-on flag Pins STB, EN and TXD VIH VIL IIH HIGH-level input voltage LOW-level input voltage HIGH-level input current pins STB and EN pin TXD IIL LOW-level input current pins STB and EN pin TXD VCC supply voltage for forced power-on standby mode (fail safe) VI = 1 V 4 -100 2.75 8 -320 - - -800 4.5 A A V VI = 4 V - -25 9 -80 20 -200 A A 0.7VCC -0.3 - - VCC + 0.3 V 0.3VCC V - 3.5 - - 1 - V V 10 5 5 0 - 30 30 20 0 35 50 125 30 10 60 A A A A A 4 11 0 7 17 0 11 27 10 mA mA A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Pins RXD and ERR VOH HIGH-level output voltage on pin ERR on pin RXD VOL LOW-level output voltage on pins ERR and RXD lO = -100 A IO = -1 mA IO = 1.6 mA IO = 7.5 mA VCC - 0.9 - VCC - 0.9 - 0 0 - - VCC VCC 0.4 1.5 V V V V
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
SYMBOL Pin WAKE IIL Vth(WAKE) Pin INH VH IL Vdiff
PARAMETER
CONDITIONS
MIN. -1 2.5 - -
TYP. -4 3.2 - -
MAX. -10 3.9
UNIT A V
LOW-level input current
VWAKE = 0 V; VBAT = 27 V
wake-up threshold voltage VSTB = 0 V HIGH-level voltage drop leakage current IINH = -0.18 mA Sleep mode; VINH = 0 V no failures and bus failures 1, 2, 5, 6a; see Fig.4 VCC = 5 V VCC = 4.75 to 5.25 V
0.8 5
V A
Pins CANH and CANL differential receiver threshold voltage
-3.5
-3.2
-2.9
V
-0.70VCC -0.64VCC -0.58VCC V - - 0.2 - - 1.4 -110 - 100 - 1.85 2.5 V V V V mA A mA A V V
VO(reces)
recessive output voltage on pin CANH on pin CANL
VTXD = VCC RRTH < 4 k RRTL < 4 k VTXD = 0 V; VEN = VCC ICANH = -40 mA ICANL = 40 mA normal operating mode; VCANH = 0 V; VTXD = 0 V low power modes; VCANH = 0 V; VCC = 5 V VCC - 1.4 - - -45 - 45 - 1.5 1.1 - -80 -0.25 70 0 1.7 1.8 VCC - 0.2 -
VO(dom)
dominant output voltage on pin CANH on pin CANL
IO(CANH)
output current on pin CANH
IO(CANL)
output current on pin CANL
normal operating mode; VCANL = 14 V; VTXD = 0 V low power modes; VCANL = 12 V; VBAT = 12 V
Vdet(CANH) detection threshold voltage for short-circuit to battery voltage on pin CANH Vdet(CANL) detection threshold voltage for short-circuit to battery voltage on pin CANL Vth(wake) wake-up threshold voltage on pin CANL on pin CANH Vth(wake) difference of wake-up threshold voltages Vse(CANH) single-ended receiver threshold voltage on pin CANH
normal operating mode low power modes
normal operating mode
6.5
7.3
8
V
low power modes low power modes low power modes normal operating mode and failures 4, 6 and 7 VCC = 5 V VCC = 4.75 to 5.25 V
2.5 1.1 0.8
3.2 1.8 1.4
3.9 2.5 -
V V V
1.5 0.30VCC
1.7 0.34VCC
1.85 0.37VCC
V V
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
SYMBOL Vse(CANL)
PARAMETER single-ended receiver threshold voltage on pin CANL
CONDITIONS normal operating mode and failures 3 and 3a VCC = 5 V VCC = 4.75 to 5.25 V
MIN.
TYP.
MAX.
UNIT
3.15 0.63VCC - -
3.3 0.66VCC 50 50
3.45 0.69VCC 100 100
V V
Pins RTH and RTL Rsw(RTL) Rsw(RTH) switch-on resistance normal operating mode; between pin RTL and VCC IO < 10 mA switch-on resistance between pin RTH and ground output current on pin RTL normal operating mode; IO < 10 mA
VO(RTH) IO(RTL) Ipu(RTL) Ipd(RTH)
output voltage on pin RTH low power modes; IO = 1 mA low power modes; VRTL = 0 V pull-up current on pin RTL normal operating mode and failures 4, 6 and 7 pull-down current on pin RTH normal operating mode and failures 3 and 3a
- -1.25 - -
0.7 -0.65 75 75
1.0 -0.3 - -
V mA A A
Thermal shutdown Tj junction temperature for shutdown 155 165 180 C
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
TIMING CHARACTERISTICS VCC = 4.75 to 5.25 V; VBAT = 5 to 27 V; VSTB = VCC; Tamb = -40 to +125 C; unless otherwise specified. All voltages are defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature range by design, but only 100% tested at 25 C. SYMBOL tt(r-d) PARAMETER CANL and CANH output transition time for recessive-to-dominant CANL and CANH output transition time for dominant-to-recessive propagation delay TXD to RXD (LOW) CONDITIONS 10 to 90%; C1 = 10 nF; C2 = 0; R1 = 100 ; see Fig.5 10 to 90%; C1 = 1 nF; C2 = 0; R1 = 100 ; see Fig.5 no failures and failures 1, 2, 5, 6a; see Figs 4 and 5 C1 = 1 nF; C2 = 0; R1 = 100 C1 = C2 = 3.3 nF; R1 = 100 failures 3, 3a, 4, 6 and 7; see Figs 4 and 5 C1 = 1 nF; C2 = 0; R1 = 100 C1 = C2 = 3.3 nF; R1 = 100 tPD(H) propagation delay TXD to RXD (HIGH) no failures and failures 1, 2, 5, 6a; see Figs 4 and 5 C1 = 1 nF; C2 = 0; R1 = 100 C1 = C2 = 3.3 nF; R1 = 100 failures 3, 3a, 4, 6 and 7; see Figs 4 and 5 C1 = 1 nF; C2 = 0; R1 = 100 C1 = C2 = 3.3 nF; R1 = 100 tCANH(min) tCANL(min) tWAKE(min) minimum dominant time for wake-up on pin CANH minimum dominant time for wake-up on pin CANL minimum time on pin WAKE low power modes; VBAT = 12 V low power modes; VBAT = 12 V low power modes; VBAT = 12 V; for wake-up after receiving a falling or rising edge normal mode failure 3 and 3a failure 4, 6 and 7 low power modes; VBAT = 12 V failure 3 and 3a failure 4 and 7 1.6 0.1 - - 8.0 1.6 ms ms 1.6 0.3 - - 8.0 1.6 ms ms - - 7 7 7 1.1 1.5 - - - 1.7 2.2 38 38 38 s s s s s - - 1.2 2.5 1.9 3.3 s s - - 0.85 1.1 1.4 1.7 s s - - 0.75 1 1.35 1.75 s s MIN. 0.35 TYP. 0.60 MAX. - UNIT s
tt(d-r)
0.2
0.3
-
s
tPD(L)
tdet
failure detection time
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
SYMBOL trec
PARAMETER failure recovery time
CONDITIONS normal mode failure 3 and 3a failure 4 and 7 failure 6 low power modes; VBAT = 12 V failures 3, 3a, 4 and 7
MIN. 0.3 7 125 0.3 5
TYP. - - - - - -
MAX. 1.6 38 750 1.6 50 4
UNIT ms s s ms s ms
th(min) tdis(TXD) pc
minimum hold time of goto-sleep command disable time of TXD permanent dominant timer pulse-count difference between CANH and CANL normal mode; VTXD = 0 V normal mode and failures 1, 2, 5 and 6a failure detection (pin ERR becomes LOW) failure recovery
0.75
- -
4 4
- -
handbook, full pagewidth
VTXD
VCC 0V
VCANL
5V 3.6 V 1.4 V
VCANH
0V
2.2 V
-3.2 V Vdiff VRXD 0.7VCC 0.3VCC tPD(L) Vdiff = VCANH - VCANL. tPD(H)
MGL424
-5 V
Fig.4 Timing diagram for dynamic characteristics.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TEST AND APPLICATION INFORMATION
TJA1054
handbook, full pagewidth
+5 V INH WAKE TXD STB EN RXD 1 7 2 5 6 3 13 20 pF GND 4 ERR
MGL423
BAT 14
VCC 10 8 RTH R1 C1
12
CANL C2
TJA1054
11 CANH
9
RTL R1 C1
For testing, the 100 termination resistors are not connected to RTH or RTL because minimum 500 per transceiver is allowed.
Fig.5 Test circuit for dynamic characteristics.
handbook, full pagewidth
+12 V
+5 V
10 F VCC 10 8 RTH 125 511 12 CANL 1 nF 11 CANH 511 9 13 20 pF GND 4 ERR
MGL426
INH WAKE TXD STB EN RXD 1 7 2 5 6 3 14
BAT
1 nF
TJA1054
GENERATOR
1 nF
RTL 125 1 nF
The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
handbook, full pagewidth
VBAT
BATTERY
P8xC592/P8xCE598
CAN CONTROLLER
VDD
+5 V +5 V
CTX0
CRXO
Px.x
Px.x
Px.x
TXD WAKE 2 7 3
RXD 5
STB 4
ERR 6
EN 1
INH 14 BAT VCC GND 100 nF
TJA1054
CAN TRANSCEIVER
10 13
8 RTH
11 CANH
12 CANL
9 RTL
CAN BUS LINE
MGL425
Fig.7 Application diagram.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
PACKAGE OUTLINE SO14: plastic small outline package; 14 leads; body width 3.9 mm
TJA1054
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06S JEDEC MS-012AB EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TJA1054
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ not suitable suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes
TJA1054
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Feb 11
19
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
SCA62
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
285002/00/01/pp20
Date of release: 1999 Feb 11
Document order number:
9397 750 03636

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